Manufacturing firm Flex has partnered with JetCool to expand its liquid cooling offerings.
The company this week announced new reference platforms for liquid-cooled servers, racks, and power products
“Flex delivers integrated data center IT and power infrastructure solutions that address the growing power and compute demands in the AI era,” said Michael Hartung, president and chief commercial officer, Flex. “We are expanding our unique portfolio of advanced manufacturing capabilities, innovative products, and lifecycle services, enabling customers to deploy IT and power infrastructure at scale and drive AI data center expansion.”
The company has announced customizable, open standard-based, compute reference designs integrating JetCool’s SmartPlate direct-to-chip liquid cooling solution. The modular compute platform includes a new Host Processor Module (HPM) that supports up to two Intel Xeon 6900 series with P-cores and also integrates the Flex Secure Control Module (SCM) 2.0.
“Advanced cooling systems are essential for supporting AI-enabled applications, high-performance computing, and increased rack power densities,” said Rob Campbell, president of Communications, Enterprise and Cloud at Flex. “JetCool extends the value of single-phase, direct-to-chip liquid cooling deployments to meet the escalating power demands of AI servers. Flex’s expertise across IT and power infrastructure, global manufacturing, and vertical integration makes these solutions easier to deploy at scale.”
“As AI and other high-density workloads push the limits of conventional cooling methods, the need for advanced solutions becomes critical,” said Dr. Bernie Malouin, CEO of JetCool, who notes that the company is able to combine its liquid cooling solutions with Flex’s manufacturing capabilities.
“Together, we are poised to deliver servers for AI at scale that not only meet but exceed the performance and efficiency requirements of hyperscalers and enterprise customers,” he added.
The Flex Open Rack V3 solution is compatible with ORv3 specification and customizable to support 21″ and 19″ footprints for IT equipment. Flex Power Modules also launched new Intermediate Bus Converters (IBC).
JetCool is also launching a 6U in-rack Coolant Distribution Unit (CDU) that is capable of cooling 300kW and scalable to 2.1MW at a row level.
Flex has recently partnered with supercapacitor specialist Musashi Energy Solutions to develop an energy storage solution aimed at AI data centers.
